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Base Introduction:
Production bases for chips of WINSEMI are distributed in Korea, Taiwan and China mainland, while its packaging bases are located in Guangzhou bonded zone. WINSEMI has obtained quality management system of ISO9001 (2008) and environmental management system of ISO14000 through constant efforts. WINSEMI, with a total investment of more than RMB220 million, covers an area of 20,000 square meters, and its construction area and clean area is respectively 18,000 square meters and 1,500 square meters. WINSEMI is in the lead in the domestic packaging industry at present with its purification level reaching 1000 level. 


Manufacturing equipment:


 


 Possess professional technical support and sales service

 Get through ERP system operation procedure, conduct accurate management

 Quickly react to the market, provide perfect service


 Dust-free space reaches 1000 level

 Most advanced and most professional manufacturing equipment 

 Advanced management system

Power equipment:



Our company has the independence of the company advanced power system, compressed air with full no oil air compressor, preparation of nitrogen
and hydrogen with liquid ammonia
decomposition method.

Manufacturing equipment:


 
DIE SAW  DIE BOND  WIRE BOND(Au/Cu)  WIRE BOND(AI) 

 
MOLD  DEFL ASH  POST BAKE  PLAT ING 

 

TRIM FORM  TEST 

RELIABILITY:



RELIABILITY